3D NAND
SK Hynix showcased its 321-layer TLC NAND memory at the Flash Memory Summit 2023. The South Korean company is the first NAND maker to publicly demonstrate 3D NAND with over 300 layers. Although such memory is expected in mass production in 2025, the demonstration is meant to showcase SK Hynix's preparedness for the next wave of non-volatile memory technology. This showcased 321-layer 3D NAND memory device boasts a 1 Tb (128 GB) capacity with TLC architecture, but SK Hynix refrained from revealing other details about it, such as interface speed. Meanwhile, the company mentioned that the chip features a 59% improvement in productivity compared to a 512 Gb 238-layer 3D TLC device, highlighting a significant improvement in per-wafer storage density. Whether or not the new...
AnandTech Year in Review 2018: SSDs
Rounding out our series of articles taking a look back at 2018, the past year has been one of the most exciting years in the SSD space since the...
40 by Billy Tallis on 1/2/2019
SK Hynix Launches 96-Layer 3D NAND and Discloses QLC Plans
SK Hynix this week officially launched its new 96-layer 3D NAND flash memory chips, which feature a new architecture and a faster interface. The NAND has already been qualified...
4 by Anton Shilov on 11/8/2018
Samsung Shares SSD Roadmap for QLC NAND And 96-layer 3D NAND
At Samsung's Tech Day event today in San Jose, the company shared their SSD roadmap for transitioning to 96-layer 3D NAND and introducing four bit per cell (QLC) NAND...
16 by Billy Tallis on 10/17/2018
Western Digital Unveils iNAND MC EU321: a UFS 2.1 Drive Based on 96L 3D NAND
Western Digital has announced its new lineup of UFS 2.1-based embedded storage devices for smartphones, tablets, PCs, and other mobile applications. The new iNAND MC EU321 drives are based...
5 by Anton Shilov on 10/12/2018
Intel Veteran Becomes Chairman of Toshiba Memory
Toshiba Memory Corp. (TMC) on Thursday disclosed that Stacy Smith, a former high-ranking exec of Intel, was appointed executive chairman, effective October 1. Mr. Smith brings a wealth of...
3 by Anton Shilov on 10/11/2018
Kingston Launches HyperX Savage Exo External SSD
Kingston has announced its new external SSDs. The HyperX Savage Exo drive is uses a USB Type-C interface and are compatible with Microsoft Windows, Apple macOS, Microsoft’s Xbox One...
3 by Anton Shilov on 9/27/2018
Toshiba Memory and Western Digital Open Fab 6 and New Memory R&D Center
Toshiba Memory and Western Digital on Wednesday officially opened up their new Fab 6 and Memory R&D Center. Both facilities are located at their Yokkaichi operations site that now...
6 by Anton Shilov on 9/20/2018
GIGABYTE Launches M.2 PCIe SSDs: Phison PS5008-E8T, Up to 512 GB
GIGABYTE this week expanded its lineup of SSDs with its new M.2 PCIe drives. The company keeps its cautious approach to the storage market and for now continues to...
12 by Anton Shilov on 9/20/2018
Phison: PS5012-E12 Controller in Mass Production, 20+ SSDs Incoming
Phison and its partners have been absent from the high-end SSD market in the past couple of years. This is partly because its memory supplier, Toshiba, was somewhat late...
14 by Anton Shilov on 9/7/2018
The Toshiba XG6 1TB SSD Review: Our First 96-Layer 3D NAND SSD
For the second year in a row, Toshiba is the first to ship a new generation of 3D NAND. The new XG6 NVMe SSD for OEMs otherwise changes little...
32 by Billy Tallis on 9/6/2018
Samsung Launches Broad Range Of Datacenter SSDs
Today Samsung is launching a new generation of datacenter SSD models that are intended for small and medium businesses and will be sold through online retailers. Most of the...
14 by Billy Tallis on 9/4/2018
ATP Announces eMMC5.1 3D NAND Storage For Extreme Temperatures
ATP recently introduced its new eMMC storage solutions designed for industrial applications and rough environments. The storage devices are based on 3D NAND memory and can work in SLC...
1 by Anton Shilov on 8/15/2018
Flash Memory Summit 2018, Yangtze Memory Technology Keynote Live Blog: Unleashing 3D NAND
The final talk of this session is from Yangtze Memory Technology (YMTC). We published their announcement this week, but they have set a very interesting talk for the show...
5 by Ian Cutress & Billy Tallis on 8/7/2018
Toshiba Announces XL-Flash Low-Latency 3D NAND
At Flash Memory Summit today, Toshiba announced a new variant of 3D NAND flash memory, XL-Flash. Made with the same basic process as their 96-layer BiCS4 3D NAND...
3 by Billy Tallis on 8/7/2018
The Intel SSD 660p SSD Review: QLC NAND Arrives For Consumer SSDs
The first consumer SSD with QLC NAND has arrived, and it shows that there isn't much to worry about. For most use cases, the Intel SSD 660p is as...
93 by Billy Tallis on 8/7/2018
Yangtze Memory Unveils Xtacking Architecture for 3D NAND: Up to 3 Gbps I/O
Yangtze Memory Technologies Co. (YMTC) on Monday unveiled key details regarding its Xtacking architecture that will be used for its upcoming 3D NAND flash memory chips. The company's technology...
7 by Anton Shilov on 8/6/2018
Toshiba Begins to Construct New BiCS 3D NAND Fab in Iwate Prefecture
Toshiba Memory Corp. this week held a groundbreaking ceremony for its new BiCS 3D NAND flash memory fab, which is located in Japan's Iwate prefecture. Toshiba anticipates construction to...
7 by Anton Shilov on 7/25/2018
Toshiba Announces XG6 NVMe SSD With 96L 3D NAND
Toshiba is introducing their first SSD using 96-layer 3D NAND flash memory. The new Toshiba XG6 is an update to their XG5 client NVMe SSD for the OEM market...
9 by Billy Tallis on 7/23/2018
Intel Teases Upcoming QLC SSD For Datacenters
Intel has started production of their first datacenter PCIe SSD using QLC 3D NAND flash memory, which stores four bits per memory cell. This isn't a full product announcement...
6 by Billy Tallis on 7/19/2018
The Phison E12 Reference Design Preview: A Next-Gen NVMe SSD Controller
Phison's latest NVMe SSD controller will soon power a new generation of high-end consumer SSDs that may bring great performance and power efficiency to a cheaper price bracket than...
28 by Billy Tallis on 7/18/2018
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