Solidigm Lays Off Employees Due to Industry Downturn
The solid state storage industry has been in a well-documented slide for the better part of the last year now. With storage product demand from both the client and...
18 by on 10/25/2023
Micron and SK hynix Ship LPDDR5-9600 Memory for Next-Gen Smartphones
Fast memory is crucial for the performance of high-end system-on-chips that are getting more sophisticated every year. When it comes to smartphones, the most obvious way to boost memory...
23 by on 10/25/2023
Report: AMD and NVIDIA Set to Offer Arm-Based Processors for PCs
Apple's release of Arm-based system-on-chips for its desktops and laptops three years ago demonstrated that such processors could offer competitive performance and power consumption. On the Windows-based PC front...
43 by on 10/25/2023
Zotac's Zbox Pico PI430AJ Uses Frore's AirJet Solid-State Active Cooling
Zotac has introduced the industry's first compact PC featuring Frore's AirJet solid-state cooling system. Zotac's ultra-compact Zbox Pico PI430AJ is powered by Intel's Core i3 processor is designed primarily...
18 by on 10/20/2023
TSMC Q3 Earnings: 3nm Production Node Accounts for 6% of Revenue
Although Taiwan Semiconductor Manufacturing Co. formally started production of chips using its N3 (3nm-class) process technology back in late 2022, the company did not recognize any meaningful N3 revenue...
7 by on 10/19/2023
Seagate Unveils Exos X24 24TB and 28 TB: Setting the Stage for HAMR HDDs
Seagate on Wednesday introduced its Exos X24 family of hard drives, it's highest capacity series of drives to date. The new family is comprised of both conventional magnetic recording...
16 by on 10/19/2023
Arm Total Design to Facilitate Development of Custom Datacenter SoCs
Arm this week introduced its Arm Total Design initiative, which is aimed at accelerating development of custom datacenter-oriented system-on-chip (SoC) designs using Neoverse Compute Subsystems (CSS). The collaborative ecosystem...
1 by on 10/18/2023
Qualcomm Swaps Out Arm for RISC-V for Next-Gen Google Wear OS Devices
As part of a broad collaborative agreement with Google, Qualcomm this week said that that it will be adopting the RISC-V instruction set architecture (ISA) for a future Snapdragon...
9 by on 10/18/2023
Canon Prepares Nanoimprint Lithography Tool To Challenge EUV Scanners
Canon has recently revealed its FPA-1200NZ2C, a nanoimprint semiconductor manufacturing tool that can be used to make advanced chips. The device uses nanoimprint lithography (NIL) technology as an alternative...
14 by on 10/17/2023
TSMC: We Want OSATs to Expand Their Advanced Packaging Capability
Almost since the inception of the foundry business model in the late 1980s, TSMC would produce silicon. In contrast, an outsourced semiconductor assembly and test (OSAT) service provider would...
2 by on 10/16/2023
TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion
Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC's roadshow was dedicated to the next generation of...
20 by on 10/12/2023
Samsung Lines Up First Server Customer For 3nm Fabs
Although Samsung Foundry was the first contract fab to formally start mass production of chips on a 3 nm-class process, so far, the company's latest process has largely been...
5 by on 10/12/2023
HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...
11 by on 10/12/2023
TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips
This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better...
4 by on 10/12/2023
Intel Launches Arc A580: A $179 Graphics Card for 1080p Gaming
When Intel unveiled its range of Arc A-series desktop graphics cards last year, it introduced four models: the Arc A770, Arc A750, Arc A580, and Arc A380. However, the...
9 by on 10/10/2023
Tenstorrent to Use Samsung’s SF4X for Quasar Low-Cost AI Chiplet
Tenstorrent this week announced that it had chosen to use Samsung's SF4X (4 nm-class) process technology for its upcoming low-cost, low-power codenamed Quasar chiplet for machine learning workloads. The...
13 by on 10/3/2023
Asus Formally Completes Acquisition of Intel's NUC Business
ASUS has formally acquired Intel's Next Unit of Computing (NUC) products based on Intel's 10th to 13th Generation Core processors. Asus is set to continue building and supporting Intel's...
9 by on 10/2/2023
Micron to Ship HBM3E Memory to NVIDIA in Early 2024
Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for...
7 by on 9/28/2023
Micron Samples 128 GB Modules Based on 32 Gb DDR5 ICs
Micron is sampling 128 GB DDR5 memory modules, the company said at its earnings call this week. The modules are based on the company's latest single die, non-stacked 32...
9 by on 9/28/2023
eMMC Destined to Live a Bit Longer: KIOXIA Releases New Generation of eMMC Modules
While the tech industry as a whole is well in the middle of transitioning to UFS and NVMe storage for portable devices, it would seem that the sun won't...
11 by on 9/27/2023
Facebook
Twitter
RSS
